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As we got our hands on phones powered by the Dimensity 9400 like the vivo X200 and OPPO Find X8 in the Philippines, MediaTek has officially unveiled the Dimensity 8400, which is expected to power several 2025 midrange phones.
Like the Dimensity 9400, the Dimensity 8400 uses purely performance cores–specifically the Cortex-A725. It has a 1/3/4 layout, with the prime core running at up to 3.25 GHz, and MediaTek promises as much as 41% better multi-core performance than the Dimensity 8300. We know that the Dimensity 8300 gave the Snapdragon 8 Gen 2 a run for its money, so we wouldn’t be surprised if the Dimensity 8400 can go toe-in-toe with the Snapdragon 8 Gen 3. Aside from all those performance gains, MediaTek also promises as much as 44% better power efficiency—which is a bold statement given the use of entirely performance cores.
On the GPU side of things, the Dimensity 8400 uses a Mali-G720 MC7 that promises 24% better peak performance and up to 42% better power efficiency than the Dimensity 8300. You’re also getting a NPU 880, making the Dimensity 8400 ready for the latest Generative AI applications and native support for most LLMs. Other noteworthy features include support for WQHD+ displays at up to 144hz, up to 320-megapixel single camera (up to three 32-megapixel cameras) with up to 4K60 video recording, and support for UFS 4.0 storage and LPDDR5X RAM.
Both Xiaomi and realme confirmed that they will be debuting phones using the Dimensity 8400. Xiaomi confirmed that it will be the Redmi Turbo 4 that will debut MediaTek’s new midrange chip, with the phone expected to be known as the POCO X7 Pro globally.